ADATA introduces heat reducing covers for high-speed DDR5 memory modules, lowering temperatures by 10%

ADATA, a leading manufacturer of high-speed memory modules, has introduced a new covering that will enable a significant reduction in their operating temperatures. Initially, this innovative technology will be integrated into DDR5-8000 memory modules under the XPG brand, promising a cutback in working temperature of memory chips by up to 10% or approximately 8.5 degrees Celsius.

“The new thermal coating technology employed in XPG’s overclocked memory modules effectively reduces their operational temperature by 10%. […] Real tests demonstrate a temperature decrease of 8.5 degrees Celsius in overclocked DDR5 RAM modules equipped with the heat-dissipating PCB coating technology, compared to standard overclocked memory. This also leads to a 10.8% increase in heat dissipation efficiency,” stated the ADATA press release.

In enhancing the area available for heat dissipation, the new coating, when paired with a radiator, ensures optimum cooling for memory modules. ADATA aims to implement this innovative technology in its highest-speed RAM modules, offering data transfer speeds of 8000 MT/s and beyond.

The manufacturer also shared an image visualizing the efficiency of the thermal coating in a memory module without a fitted radiator, contrasting it with a similar RAM module devoid of both a radiator and the new coating. The specific speed of the memory module has not been disclosed by ADATA.

Comparison of memory modules

According to the manufacturer’s press release, the first RAM modules equipped with this innovative thermal coating will be available for purchase in the second quarter of this year. In the run-up to Computex 2024, to be held later this year, the company will present memory modules from the LANCER NEON RGB and LANCER RGB series that employ this unique thermal coating.

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