MediaTek Unveils Improved Dimensity 8250 Chipset for Mid-Range Smartphones
Leading semiconductor company MediaTek has launched the Dimensity 8250 chipset, an enhanced version of the previously released Dimensity 8200 model. The chip, targetted at mid-range smartphones, features incremental updates while continuing to utilise the 4-nm TSMC N4 process.
Key Features and Capabilities of Dimensity 8250
Featuring four Cortex-A78 cores, the Dimensity 8250 boasts one core operating at 3.1 GHz and the remaining three at 3.0 GHz. It is complemented by an additional four Cortex-A55 cores, running at 2.0 GHz each. The chipset uses an Arm Mali-G610 as the GPU.
The new chip supports FHD+ screens at refresh rates up to 180 Hz, or QHD+ displays at up to 120 Hz. The devices built on the Dimensity 8250 (and also the Dimensity 8000) will support quad-channel LPDDR5 RAM with a speed of up to 6400 Mbps and UFS 3.1 flash memory.
Camera and Video Capabilities
The Imagiq 785 signal processor powers the camera, supporting sensors up to 320 megapixels. It enables video shooting with three 32-Mp cameras simultaneously using 14-bit HDR and bokeh effects when a depth sensor is present. The primary camera also offers 2x zoom without any loss in quality.
Videos can be shot in 4K at 60 frames per second with HDR. The built-in hardware AV1 decoder enables resolutions up to 4K. The chipset also boasts of support for HDR10+ technology and a built-in SDR to HDR conversion function using AI. The AI is also responsible for suppressing video noise. AI algorithm acceleration is powered by the integrated APU 580.
Connectivity Features
Mirroring its predecessor, the Dimensity 8250 offers compatibility with 5G networks, Wi-Fi 6E, and Bluetooth 5.3. It supports Bluetooth LE Audio and Dual-Link True Wireless Stereo Audio.
First Smartphone with Dimensity 8250
Oppo Reno12, the first smartphone to leverage the new Dimensity 8250, is set to be announced on May 23.
